TSMC put on 2-nm technology: the rejection of FinFET and production in 2023 or 2024
Last year, the Taiwanese company TSMC began a massive investment in the development of 2-nm process. At that time there was no clarity in the issues of transition to the 2-nm technological standards, but to date, much is clear. According to rumors, the company will reveal the official plans for the development of the 2-nm at the next conference, but in the meantime get acquainted with the preliminary information.
As claimed by Taiwanese sources,
Risk production of chips with the norms of 2 nm will commence in 2023, what will happen a year after the start of mass production of 3-nm semiconductors. To mass production of 2-nm TSMC solutions will begin in 2024. At this point she expects on perfection of technology of production of chips to finally beat the rival- the company Samsung.
As for Samsung, it focused on the development and implementation of a 3-nm process technology. There is a high probability that the South Korean company at first to miss the production standards of 4 nm, which were listed in early plans. One time Samsung even plan to start production of GAA transistors within the 4-nm process, but later moved the item into the implementation phase of a 3-nm technological standards.
However, a 3-nm process technology to Samsung, GAA MOSFETs, which will be much more progressive with regard to the characteristics of the chips 3-nm TSMC process technology with FinFET transistors. But analysts believe that in the long run it will not help Samsung in competition with TSMC. For example, Samsung first started to use chip production EUV scanners, but it did not help her to approach the indicators TSMC. With 3-nm process technology, the South Korean manufacturer again maybe the time to get ahead, but TSMC plans to avoid him at the next turn ― on transition on a 2-nm production rates.